The IPO year of Aehr Test Systems is 1997
Initial public offering is a type of public offering in which shares of a company usually are sold to institutional investors that in turn, sell to the general public, on a securities exchange, for the first time.
Through IPO a privately held company transforms into a public company. Initial public offerings are mostly used by companies to raise the expansion of capital, possibly to monetize the investments of early private investors, and to become publicly traded enterprises. A company selling shares is never required to repay the capital to its public investors. After the IPO, when shares trade freely in the open market, money passes between public investors.
Although IPO offers many advantages, there are also significant disadvantages, chief among these are the costs associated with the process and the requirement to disclose certain information that could prove helpful to competitors.
The IPO process is colloquially known as going public. Details of the proposed offering are disclosed to potential purchasers in the form of a lengthy document known as a prospectus. Most companies undertake an IPO with the assistance of an investment banking firm acting in the capacity of an underwriter. Underwriters provide several services, including help with correctly assessing the value of shares.
headquartered in fremont, california, aehr test systems is a worldwide supplier of systems for burning-in and testing memory and logic integrated circuits and has an installed base of more than 2,500 systems worldwide. aehr test has developed and introduced several innovative products, including the abts, foxtm and max systems and the diepak® carrier. the abts system is aehr test’s newest system for packaged part test during burn-in for both low-power and high-power logic as well as all common types of memory devices. the fox system is a full wafer contact test and burn-in system. the max system can effectively burn-in and functionally test complex devices, such as digital signal processors, microprocessors, microcontrollers and systems-on-a-chip. the diepak carrier is a reusable, temporary package that enables ic manufacturers to perform cost-effective final test and burn-in of bare die.